Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo Altura: aprox EDA005664403

Name: Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo Altura: aprox EDA005664403
Brand: ambiflex.com.br
SKU: 25855499697
Price: 7995.00 USD
Availability: InStock
Rating: 4.8811 (25 reviews)

SKU 25855499697 · ★ 4.9

EUR7995.00 EUR8024.00

Pay in 4 interest-free payments of $1998.75 Learn more

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Ships within 48 hours · Estimated delivery Nov 4 - Nov 9

Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo Altura: aprox EDA005664403

Kiosk notes

Description

Plantilla de reballing BGA de CPU 2UUL BG03 de 0,12 mm para iPhone 17 doble modo Altura: aprox EDA005664403 Altura: aprox Altura: 90mm lo que mejora las tasas de éxito de la soldadura Diseño de precisión de 0

Exchange/Return Notes

We offer a 30-day return/exchange service after receiving.
Final sale items are not eligible for returns or exchanges.
To process your return/exchange, please contact us at [email protected]
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